TAP-2.5D: A Thermally-Aware Chiplet Placement Methodology for 2.5D Systems

  1. Ma, Y.
  2. Delshadtehrani, L.
  3. Demirkiran, C.
  4. Abellan, J.L.
  5. Joshi, A.
Proceedings:
Proceedings -Design, Automation and Test in Europe, DATE

ISSN: 1530-1591

ISBN: 9783981926354

Year of publication: 2021

Volume: 2021-February

Pages: 1246-1251

Type: Conference paper

DOI: 10.23919/DATE51398.2021.9474011 GOOGLE SCHOLAR
Data source: Scopus